StacksVerified U.S. regulatory reference

40 CFR Part 98, Table I-3

Verified against eCFR.gov as of June 20, 2026View official text on eCFR.gov
Process type/sub-typeProcess gas i
CF4C2 F6 | CHF3 | CH2 F2 | C2 HF5 | CH3 F | C3 F8 | C4 F8 | NF3 | SF6 | C4 F6 | C5 F8 | C4 F8 O

Etching/Wafer Cleaning

1-Ui0.730.720.510.130.0640.7NA0.140.190.550.0830.072NA
BCF4NA0.10.0850.0790.077NANA0.110.0040.130.095NANA
BC2 F60.041NA0.0350.0250.0240.0034NA0.0370.0250.110.0730.014NA
BC4 F8NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BCHF30.0910.047NA0.049NANANA0.04NA0.00120.0660.0039NA

Chamber Cleaning

In situ plasma cleaning

1-Ui0.920.55NANANANA0.40.10.18NANANA0.14
BCF4NA0.19NANANANA0.20.110.14NANANA0.13
BC2 F6NANANANANANANANANANANANA0.045
BC3 F8NANANANANANANANANANANANANA

Remote plasma cleaning

1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BF2NANANANANANANANA0.5NANANANA

In situ thermal cleaning

1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31920, Apr. 25, 2024]